4 mistakes that PCB engineers need avoid in PCB design

Jun. 15, 2018

PCB design is no doubt significant part for creating a PCB board, and also the most difficult process according to some posts in the PCB design forums. Even so, there are some electronics hobbyists and engineers loving doing the PCB designing work by themselves instead of finding a online PCB design service. So if you are one of them, you are gonna have to pay much more attention to these “pitfalls”.

1. Unclear specification of processing layer

The design of single-board PCB should be processed in the top layer. But it could be processed in the front and back sides if without any specification, the board made is likely not to be good for components soldering.

2. A large area of copper foil is too close to the outline

The copper foil should be at least 0.2mm away from the outline, being too close will likely cause copper foil affected by milling and result in lifted copper foil and detached solder mask.

3. Draw the pad with filler

Drawing the pad with filler when designing routing may be ok in the DRC test, but it is not ok for tooling. Because the pad can not directly generate the solder mask data, the area of filler will be covered by the solder mask, which will make it quite difficult to solder components.

4. Character is not in the place

Character covering the pad will bring inconvenience to the on-off testing and component soldering of PCB. Also, if character is too small or too big, it will cause difficulties to the PCB manufacturing process like silkscreen.

4 mistakes that PCB engineers need avoid in PCB design