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PCB Quality
During the production and before shipment phase, each process will be strictly inspected. And we will have reference instruction and report for it.
Outgoing Report
Cover and Document list
- Certification Of Compliance
- Final Product Inspection Report
- Hole Size and Outline Dimension
- Micro-section Report
- Solderability and Thermal Stress Report
- E-Test Report
- RoHS Compliance Statement
- Ionic Contamination Report
- Impedance Test Report
Certificate of Compliance
| Certification Items |
This certificate is to serve as proof that all requirements of customer’s specification are maintained in fabrication of this including the followings. 1. All PCBs shipped comply with purchasing specifications and/or drawings. 2. Where no spec in the drawings and/or materials supplied, IPC is available. 3. Laminate and prepreg used in fabrication are in compliance with IPC-4101. 4. All finish boards have been 100% electrically tested and passed. 5. Finish boards meet all requirements of UL 796 and flammability rating 94V0. 6. Non-operational printed circuit board and packing material should be discarded according to local laws. All information listed on this document is hereby certified in writing to be true. |
Final Product Inspection Report
(B) Material | ||||||
1 | Raw Material | FR4,Tg170 EMC EM827 | YES | √ | ||
2 | Core Thickness | 0.13±0.018mm | YES | √ | ||
3 | Copper Thickness (OZ) | (1/3)/1/1/1/1/1/1/(1/3) | YES | √ | ||
(C) Marking & Circuitry | ||||||
1 | Min Line Width | 0.102-0.152mm | 0.13mm | √ | ||
2 | Min Spacing | 0.162-0.244mm | 0.20mm | √ | ||
3 | Front & Back registration | +/- 0.076mm | YES | √ | ||
(D) Surface treatment thickness | ||||||
1 | Process | Immersion Gold | OK | √ | ||
2 | HAL | / | / | / | ||
3 | lead-Free HAL | / | / | / | ||
4 | Immersion Gold | Ni | 3-6um | 4.326um | √ | |
Au | 0.050um(min) | 0.059um | √ | |||
5 | Immersion Silver | / | / | / | ||
6 | Immersion Tin | / | / | / | ||
7 | Gold Finger | Ni | / | / | / | |
Au | / | / | / | |||
8 | OSP | / | / | / | ||
(E) Soldermask & Component Marking | ||||||
1 | S/M Material & Color | SR-500 G40 & Green | YES | √ | ||
Applied on | C/S S/S | YES | √ | |||
2 | S/M Tape Test/Solvent Test | No peeloff | YES | √ | ||
3 | S/M Registration | No Misregistration | YES | √ | ||
4 | C/M Material (Color) | White | YES | √ | ||
Applied on | C/S S/S | YES | √ | |||
5 | C/M Tape Test / Solvent Test | No peeloff | YES | √ | ||
6 | C/M Registration | No Misregistration | YES | √ | ||
(F) Profile | ||||||
1 | Overall Thickness | 1.6±0.16mm | 1.56-1.64mm | √ | ||
2 | Bow & Twist (max) | 0. 75% | 0.22% | √ | ||
(G) Functional Test | ||||||
1 | Electrical Test | No Open/Short | YES | √ | ||
(H) Hole Size & Outline Dimension Report
Finished Hole Size (Unit: inch)
Code | Qty | Requirement | Actual | Acc/ Rej | Remarks |
1 | 1700 | 0.008+/-0.003 | 0.007 | ACC | |
2 | 2833 | 0.010+/-0.003 | 0.010 | ACC | |
3 | 2 | 0.032+/-0.003 | 0.031 | ACC | |
4 | 30 | 0.034+/-0.003 | 0.034 | ACC | |
5 | 24 | 0.035+/-0.003 | 0.035 | ACC | |
6 | 10 | 0.040+/-0.003 | 0.041 | ACC | |
7 | 10 | 0.045+/-0.003 | 0.046 | ACC | |
8 | 2 | 0.052+/-0.003 | 0.052 | ACC | |
9 | 2 | 0.071+/-0.003 | 0.072 | ACC | |
10 | 14 | 0.138+/-0.003 | 0.138 | ACC | |
11 | 4 | 0.080+/-0.002 | 0.080 | ACC | |
12 | 2 | 0.128+/-0.002 | 0.129 | ACC |
Code | Qty | Requirement | Actual | Acc/ Rej | Remarks |
13 | 14 | 0.060+/-0.003 | 0.062 | ACC | |
0.040+/-0.003 | 0.039 | ACC | |||
14 | 16 | 0.060+/-0.003 | 0.060 | ACC | |
0.040+/-0.003 | 0.040 | ACC | |||
15 | 2 | 0.075+/-0.004 | 0.075 | ACC | |
0.025+/-0.003 | 0.025 | ACC | |||
16 | 2 | 0.175+/-0.004 | 0.174 | ACC | |
0.025+/-0.003 | 0.025 | ACC | |||
17 | 1 | 0.250+/-0.004 | 0.249 | ACC | |
0.025+/-0.003 | 0.025 | ACC |
Dimension Measurement (Unit: mm)
No. | Requirement | Tolerance | Actual | Acc/ Rej |
1 | 5.00 | +/-0.13 | 5.00 | ACC |
2 | 110.00 | +/-0.13 | 109.99 | ACC |
3 | 100.00 | +/-0.13 | 100.02 | ACC |
4 | 1.524 | +/-0.13 | 1.56 | ACC |
5 | 52.817 | +/-0.13 | 52.80 | ACC |
6 | 154.00 | +/-0.13 | 154.01 | ACC |
V- cut Measure (Unit:mm)
1 | Items | Requirement | Actual | Acc/Rej |
Angle | 30±5° | 30° | ACC | |
Thickness | 0.4±0.1 | 0.39 | ACC |
Beveling Measure (Unit:mm)
2 | Items | Requirement | Actual | Acc/Rej |
Angle | / |
|
| |
Deepness | / |
|
|
Micro-section Report
Hole Wall Microsection Data (Unit: μm)
Request | Minimum:18.0 | Average: ≥20.0 | ||||||
No. |
A |
B |
C |
D |
E |
F |
minimum |
Average |
1 | 34.0 | 30.0 | 32.0 | 32.0 | 31.0 | 32.0 |
30.0 |
32.0 |
2 | 32.0 | 31.0 | 33.0 | 34.0 | 30.0 | 33.0 | ||
Result | ACC | |||||||
Blind Hole Wall Copper Data (Unit: μm)
Request | Minimum: / | Average:/ | ||||||
No. | A | B | C | D | E | F | minimum | Average: |
1 |
|
|
|
|
|
|
0.0 |
#DIV/0! |
2 |
|
|
|
|
|
| ||
Result | / | |||||||
Buried Hole Wall Copper Data (Unit: μm)
Request | Minimum: / | Average:/ | ||||||
No. | A | B | C | D | E | F | minimum | Average: |
1 |
|
|
|
|
|
|
0.0 |
#DIV/0! |
2 |
|
|
|
|
|
| ||
Result | / | |||||||
Copper Thickness Data (Unit: μm)
Layer |
Base copper | Finish Copper Requirement (From Customer or IPC) |
Actual |
Result | |
Top Side | 1/3OZ | ≥38. 4 | 48.0 | ACC | |
L2 | 1OZ | min: | 24.9 | 29.0 | ACC |
L3 | 1OZ | min: | 24.9 | 31.0 | ACC |
L4 | 1OZ | min: | 24.9 | 30.0 | ACC |
L5 | 1OZ | min: | 24.9 | 29.0 | ACC |
L6 | 1OZ | min: | 24.9 | 30.0 | ACC |
L7 | 1OZ | min: | 24.9 | 31.0 | ACC |
Bottom Side | 1/3OZ | ≥38. 4 | 46.0 | ACC | |
Soldermask Thickness Data (Unit: μm)
Speciment Location | Request | Actual | Result |
Circuit Surface | 10(min.) | 24.0 | ACC |
Circuit Corner | 5(min.) | 20.0 | ACC |
Dielectric Measurement Record (Unit: μm)
Layer | Request | Actual | Result |
L1-L2 | 94+/-18 | 90.0 | ACC |
L2-L3 | 130+/-25 | 125.0 | ACC |
L3-L4 | 341+/-50 | 335.0 | ACC |
L4-L5 | 130+/-25 | 125.0 | ACC |
L5-L6 | 340+/-50 | 350.0 | ACC |
L6-L7 | 130+/-25 | 124.0 | ACC |
L7-L8 | 93+/-18 | 100.0 | ACC |
Solderability & Thermal Stress Test Report
Test Method: Follow IPC-TM-650 Standard
Item 1: Solderability Test
Condition | Temperature | Time | Result |
Accept/Reject |
Remark | |
255℃±5℃ |
4S±0.5S | Blow-hole | Non-Wetting | |||
235℃±5℃ | NO | NO | ACC |
| ||
Item 2: Thermal Stress Test
Condition | Temperature | Time | Result |
Acc/Rej | |||||
288℃ |
10S,3Times |
Discolor |
Delamination |
Measling |
S/M peel off |
Blister |
Crack | ||
NO |
NO |
NO |
NO |
NO |
NO |
ACC | |||
E-Test Report
Test Method: Fixture Flying Probe | ||
Test condition | ||
A | Testing coverage rate | 100% |
B | Voltage | ≥300V |
C | Continuity Test | ≤30Ω |
D | Insulation Test | ≥30MΩ |
RoHS Compliance Statement
Statement items | ||
No. | Substance | Control Limit |
1 | Lead (Pb) | Under 1000ppm |
2 | Mercury (Hg) | Under 1000ppm |
3 | Cadmium (Cd) | Under 100ppm |
4 | Hexavalent Chromium | Under 1000ppm |
5 | Polybrominated biphenyls (PBB) | Under 1000ppm |
6 | Polybrominated diphenyl ethers (PBDE) | Under 1000ppm |
7 | Bis(2-ethylhexyl) phthalate (DEHP) | Under 1000ppm |
8 | Butyl benzyl phthalate (BBP) | Under 1000ppm |
9 | Dibutyl phthalate (DBP) | Under 1000ppm |
10 | Diisobutyl phthalate (DIBP) | Under 1000ppm |
Impedance Test Report
Test Result | |||||||||
NO. | Request (Ω) |
Layer | Referance layer | Line width (mm) | Line Space (mm) | Actual test data |
Accept/Reject | ||
Max(Ω) | Min(Ω) | Average(Ω) | |||||||
1 | 50+/-5 | L1 | L2 | 0.152 | / | 50.82 | 48.77 | 49.80 | ACC |
2 | 50+/-5 | L1 | L3 | 0.460 | / | 52.02 | 47.50 | 49.76 | ACC |
3 | 100+/-10 | L1 | L2 | 0.130 | 0.198 | 102.37 | 97.94 | 100.16 | ACC |
4 | 90+/-9 | L1 | L2 | 0.150 | 0.178 | 90.82 | 87.98 | 89.40 | ACC |
5 | 50+/-5 | L1 | L2 | 0.384 | 0.203 | 51.15 | 48.42 | 49.79 | ACC |
6 | 50+/-5 | L3 | L4/L2 | 0.127 | / | 50.08 | 48.63 | 49.36 | ACC |
7 | 100+/-10 | L3 | L4/L2 | 0.117 | 0.211 | 100.54 | 99.51 | 100.03 | ACC |
8 | 50+/-5 | L6 | L5/L7 | 0.127 | / | 50.07 | 49.95 | 50.01 | ACC |
9 | 100+/-10 | L6 | L5/L7 | 0.117 | 0.211 | 100.17 | 98.37 | 99.27 | ACC |
10 | 50+/-5 | L8 | L7 | 0.152 | / | 51.04 | 47.68 | 49.36 | ACC |
11 | 50+/-5 | L8 | L6 | 0.460 | / | 51.09 | 49.50 | 50.30 | ACC |
12 | 100+/-10 | L8 | L7 | 0.130 | 0.198 | 100.82 | 98.73 | 99.78 | ACC |