PCB Quality

During the production and before shipment phase, each process will be strictly inspected. And we will have reference instruction and report for it.

Outgoing Report

Cover and Document list

  • Certification Of Compliance
  • Final Product Inspection Report
  • Hole Size and Outline Dimension
  • Micro-section Report
  • Solderability and Thermal Stress Report
  • E-Test Report
  • RoHS Compliance Statement
  • Ionic Contamination Report
  • Impedance Test Report

Certificate of Compliance

Certification Items

This certificate is to serve as proof that all requirements of customer’s specification are maintained in fabrication of this including the followings.

1. All PCBs shipped comply with purchasing specifications and/or drawings.

2. Where no spec in the drawings and/or materials supplied, IPC is available.

3. Laminate and prepreg used in fabrication are in compliance with IPC-4101.

4. All finish boards have been 100% electrically tested and passed.

5. Finish boards meet all requirements of UL 796 and flammability rating 94V0.

6. Non-operational printed circuit board and packing material should be discarded according to local laws.

All information listed on this document is hereby certified in writing to be true.

Final Product Inspection Report

(B) Material

1

Raw Material

FR4,Tg170 EMC EM827

YES

 

2

Core Thickness

0.13±0.018mm

YES

 

3

Copper Thickness (OZ)

(1/3)/1/1/1/1/1/1/(1/3)

YES

 

(C) Marking & Circuitry

1

Min Line Width

0.102-0.152mm

0.13mm

 

2

Min Spacing

0.162-0.244mm

0.20mm

 

3

Front & Back registration

+/- 0.076mm

YES

 

(D) Surface treatment thickness

1

Process

Immersion Gold

OK

 

2

HAL

/

/

/

 

3

lead-Free HAL

/

/

/

 

4

Immersion Gold

Ni

3-6um

4.326um

 

Au

0.050um(min)

0.059um

 

5

Immersion Silver

/

/

/

 

6

Immersion Tin

/

/

/

 

7

Gold Finger

Ni

/

/

/

 

Au

/

/

/

 

8

OSP

/

/

/

 

(E) Soldermask & Component Marking

1

S/M Material & Color

SR-500 G40 & Green

YES

 

Applied on

C/S S/S

YES

 

2

S/M Tape Test/Solvent Test

No peeloff

YES

 

3

S/M Registration

No Misregistration

YES

 

4

C/M Material (Color)

White

YES

 

Applied on

C/S S/S

YES

 

5

C/M Tape Test / Solvent Test

No peeloff

YES

 

6

C/M Registration

No Misregistration

YES

 

(F) Profile

1

Overall Thickness

1.6±0.16mm

1.56-1.64mm

 

2

Bow & Twist (max)

0. 75%

0.22%

 

(G) Functional Test

1

Electrical Test

No Open/Short

YES

 

(H) Hole Size & Outline Dimension Report

Finished Hole Size (Unit: inch)

CodeQtyRequirementActualAcc/ RejRemarks
117000.008+/-0.0030.007ACC 
228330.010+/-0.0030.010ACC 
320.032+/-0.0030.031ACC 
4300.034+/-0.0030.034ACC 
5240.035+/-0.0030.035ACC 
6100.040+/-0.0030.041ACC 
7100.045+/-0.0030.046ACC 
820.052+/-0.0030.052ACC 
920.071+/-0.0030.072ACC 
10140.138+/-0.0030.138ACC 
1140.080+/-0.0020.080ACC 
1220.128+/-0.0020.129ACC 

Code

Qty

Requirement

Actual

Acc/ Rej

Remarks

13

14

0.060+/-0.003

0.062

ACC

 

0.040+/-0.003

0.039

ACC

 

14

16

0.060+/-0.003

0.060

ACC

 

0.040+/-0.003

0.040

ACC

 

15

2

0.075+/-0.004

0.075

ACC

 

0.025+/-0.003

0.025

ACC

 

16

2

0.175+/-0.004

0.174

ACC

 

0.025+/-0.003

0.025

ACC

 

17

1

0.250+/-0.004

0.249

ACC

 

0.025+/-0.003

0.025

ACC

 
Dimension Measurement (Unit: mm)
No. Requirement Tolerance Actual Acc/ Rej
1 5.00 +/-0.13 5.00 ACC
2 110.00 +/-0.13 109.99 ACC
3 100.00 +/-0.13 100.02 ACC
4 1.524 +/-0.13 1.56 ACC
5 52.817 +/-0.13 52.80 ACC
6 154.00 +/-0.13 154.01 ACC

V- cut Measure (Unit:mm)

 

1

Items

Requirement

Actual

Acc/Rej

Angle

30±5°

30°

ACC

Thickness

0.4±0.1

0.39

ACC

Beveling Measure (Unit:mm)

 

2

Items

Requirement

Actual

Acc/Rej

Angle

/

 

 

Deepness

/

 

 

Micro-section Report

Hole Wall Microsection Data (Unit: μm)

Request

Minimum:18.0

Average: 20.0

 

No.

 

A

 

B

 

C

 

D

 

E

 

F

 

minimum

 

Average

1

34.0

30.0

32.0

32.0

31.0

32.0

 

30.0

 

32.0

2

32.0

31.0

33.0

34.0

30.0

33.0

Result

ACC

Blind Hole Wall Copper Data (Unit: μm)

Request

Minimum: /

Average:/

No.

A

B

C

D

E

F

minimum

Average:

1

 

 

 

 

 

 

 

0.0

 

#DIV/0!

2

 

 

 

 

 

 

Result

/

Buried Hole Wall Copper Data (Unit: μm)

Request

Minimum: /

Average:/

No.

A

B

C

D

E

F

minimum

Average:

1

 

 

 

 

 

 

 

0.0

 

#DIV/0!

2

 

 

 

 

 

 

Result

/

Copper Thickness Data (Unit: μm)

 

Layer

 

Base copper

Finish Copper Requirement (From

Customer or IPC)

 

Actual

 

Result

Top Side

1/3OZ

≥38. 4

48.0

ACC

L2

1OZ

min:

24.9

29.0

ACC

L3

1OZ

min:

24.9

31.0

ACC

L4

1OZ

min:

24.9

30.0

ACC

L5

1OZ

min:

24.9

29.0

ACC

L6

1OZ

min:

24.9

30.0

ACC

L7

1OZ

min:

24.9

31.0

ACC

Bottom Side

1/3OZ

≥38. 4

46.0

ACC

Soldermask Thickness Data (Unit: μm)

Speciment Location

Request

Actual

Result

Circuit Surface

10(min.)

24.0

ACC

Circuit Corner

5(min.)

20.0

ACC

Dielectric Measurement Record (Unit: μm)

Layer

Request

Actual

Result

L1-L2

94+/-18

90.0

ACC

L2-L3

130+/-25

125.0

ACC

L3-L4

341+/-50

335.0

ACC

L4-L5

130+/-25

125.0

ACC

L5-L6

340+/-50

350.0

ACC

L6-L7

130+/-25

124.0

ACC

L7-L8

93+/-18

100.0

ACC

Solderability & Thermal Stress Test Report

Test Method: Follow IPC-TM-650 Standard

Item 1: Solderability Test

ConditionTemperatureTimeResultAccept/RejectRemark
255℃±5℃4S±0.5SBlow-holeNon-Wetting
235℃±5℃NONOACC 

Item 2: Thermal Stress Test

Condition Temperature Time Result Acc/Rej
288℃ 10S,3Times Discolor Delamination Measling S/M peel off Blister Crack
NO NO NO NO NO NO ACC

E-Test Report

Test Method:             Fixture               Flying Probe

Test condition

A

Testing coverage rate

100%

B

Voltage

300V

C

Continuity Test

30Ω

D

Insulation Test

30MΩ

RoHS Compliance Statement

Statement items

No.

Substance

Control Limit

1

Lead (Pb)

Under 1000ppm

2

Mercury (Hg)

Under 1000ppm

3

Cadmium (Cd)

Under 100ppm

4

Hexavalent Chromium

Under 1000ppm

5

Polybrominated biphenyls (PBB)

Under 1000ppm

6

Polybrominated diphenyl ethers (PBDE)

Under 1000ppm

7

Bis(2-ethylhexyl) phthalate (DEHP)

Under 1000ppm

8

Butyl benzyl phthalate (BBP)

Under 1000ppm

9

Dibutyl phthalate (DBP)

Under 1000ppm

10

Diisobutyl phthalate (DIBP)

Under 1000ppm

Impedance Test Report

Test Result

 

NO.

Request (Ω)

 

Layer

Referance layer

Line width (mm)

Line Space (mm)

Actual test data

 

Accept/Reject

Max(Ω)

Min(Ω)

Average(Ω)

1

50+/-5

L1

L2

0.152

/

50.82

48.77

49.80

ACC

2

50+/-5

L1

L3

0.460

/

52.02

47.50

49.76

ACC

3

100+/-10

L1

L2

0.130

0.198

102.37

97.94

100.16

ACC

4

90+/-9

L1

L2

0.150

0.178

90.82

87.98

89.40

ACC

5

50+/-5

L1

L2

0.384

0.203

51.15

48.42

49.79

ACC

6

50+/-5

L3

L4/L2

0.127

/

50.08

48.63

49.36

ACC

7

100+/-10

L3

L4/L2

0.117

0.211

100.54

99.51

100.03

ACC

8

50+/-5

L6

L5/L7

0.127

/

50.07

49.95

50.01

ACC

9

100+/-10

L6

L5/L7

0.117

0.211

100.17

98.37

99.27

ACC

10

50+/-5

L8

L7

0.152

/

51.04

47.68

49.36

ACC

11

50+/-5

L8

L6

0.460

/

51.09

49.50

50.30

ACC

12

100+/-10

L8

L7

0.130

0.198

100.82

98.73

99.78

ACC

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